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present invention relates to a substrate cutting apparatus, and more particularly to a substrate cutting apparatus for a substrate conveying apparatus and a method of substrate cutting.
In the conventional substrate cutting apparatus, a substrate is conveyed by a conveyor, and a cutter is brought into contact with the substrate to cut the substrate. FIGS. 7 and 8 illustrate such a conventional substrate cutting apparatus.
In FIG. 7, reference numeral 1 designates a main body. The main body 1 is provided with a first blade 3 extending in a first direction (vertical direction) and a second blade 4 extending in a second direction (horizontal direction). The first blade 3 and the second blade 4 are disposed below the first blade 3 and the second blade 4 so as to extend in the first direction and the second direction, respectively. The first blade 3 and the second blade 4 are driven by a driving means 5 (not shown).
In FIG. 8, reference numeral 2 designates a blade holder. The blade holder 2 is mounted on a first blade side portion of the main body 1, and holds the first blade 3, and has a second blade side portion which holds the second blade 4. The blade holder 2 is connected to a driving means 5.
The blades 3 and 4 are disposed at a predetermined interval below a conveyor 6 which conveys a substrate. The conveyor 6 is provided with a lower table 6a which is formed at the lower portion of the conveyor 6, and an upper table 6b which is supported by the lower table be359ba680
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